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With the continuous advancement of smartphone technology, major manufacturers are striving for more advanced processes and technological breakthroughs. Narrow bezel designs, as the current mainstream trend in smartphones, not only increase the screen-to-body ratio but also maximize the display area while ensuring comfortable one-handed operation. To accommodate increasingly thinner bezels, the requirements for adhesives in smartphone assembly have been steadily rising. EUBO’s UR 6140 PUR hot melt adhesive, with its excellent bonding performance, has become a key supplier in the assembly of smartphone frames for many well-known brands.
EUBO Hot Melt Adhesive in Smartphone Frame Applications
EUBO’s UR 6140 hot melt adhesive provides a reliable bonding solution for smartphone frame assembly. The UR 6140 adhesive not only delivers stable and strong bonding even in ultra-narrow bezel spaces, but also meets a wide range of design requirements.
This adhesive is suitable for bonding a variety of materials, including plastics, metals, and glass, and features rapid curing and strong initial tack, allowing bonds to be completed within minutes and significantly shortening production time. It also offers excellent high- and low-temperature resistance, solvent resistance, and impact resistance, ensuring reliable bonding even under extreme environmental conditions. These properties make the UR 6140 hot melt adhesive capable of meeting the increasingly stringent design requirements of smartphone frames while effectively improving production efficiency.
Multi-Scenario Applications of Hot Melt Adhesive in Smartphone Frames
? Plastic-to-Metal Frame Bonding: Provides strong adhesion for smartphone frames and components combining plastic and metal.
? Side Keys and Buttons Bonding: Ensures stability of side keys and buttons, unaffected by external forces.
? Camera and Speaker Component Bonding: Effectively protects cameras and speakers from external impact while maintaining their stability.
? Screen-to-Frame Sealing: Can be used for sealing screens to frames, enhancing the smartphone’s water and dust resistance.
Product Features of EUBO PUR Hot Melt Adhesive
① Excellent Weather Resistance: The PUR hot melt adhesive can withstand various environmental conditions, ensuring smartphone stability under different temperatures and humidity levels.
② Low Shrinkage and High Initial Tack: After curing, the adhesive maintains dimensional stability and provides strong initial tack, keeping components securely in place within a short time.
③ Single-Component, Reactive Hot Melt Adhesive: No mixing required, with a simple and convenient curing process for ease of use.
④ Rapid Curing: Fast curing at low temperatures, moisture-curing of the adhesive layer ensures strong initial bonding and high process efficiency.
⑤ Environmentally Friendly and Solvent-Free: Compliant with environmental standards, safe and non-toxic, suitable for modern production requirements.
In smartphone design and manufacturing, …
During the bonding and assembly of smartphone frames, EUBO PUR hot melt adhesive has demonstrated excellent performance through drop tests, tumble tests, and high- and low-temperature shock tests. The adhesive not only meets the requirements of narrow-bezel smartphone designs but also significantly improves production efficiency and reduces costs, helping manufacturers create more stable, durable, and aesthetically pleasing products.
