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PUR Hot Melt Adhesive (Moisture-Curing Polyurethane Hot Melt Adhesive) has become the preferred solution for bonding, protection, and assembly in the electronics industry due to its excellent performance. It is a 100% solid, solvent-free, and non-toxic adhesive, notable for its rapid curing: solid at room temperature, it melts upon heating for application, achieves quick initial tack upon cooling under pressure, and then completes final curing through reaction with ambient moisture.
Unique Curing Mechanism:
Applied in a molten state, it achieves initial adhesion upon cooling and forms high-strength polymers through moisture curing, significantly enhancing final bonding strength, heat resistance, and low-temperature performance.
Irreversibility:
Unlike most reversible conventional hot melts, PUR adhesive becomes irreversible after moisture curing (does not remelt upon reheating), providing superior high- and low-temperature durability.
Outstanding Electronic Applications:
High Bonding Strength: Achieves strong adhesion after curing, meeting the requirements of most electronic products.
Precision Application: Excellent control over bead size, ideal for narrow frames and fine-feature designs.
Reworkability: As a thermoplastic polyurethane, bonded components are relatively easier to disassemble for repair.
Environmentally Friendly and Safe:
Solvent-free and compliant with environmental standards.
Thanks to the above advantages, PUR hot melt adhesive is widely used in various stages of electronic product manufacturing, including:
Screen assembly and component bonding for smartphones, tablets, learning devices, GPS navigators, and wearable devices.
Window bonding and housing structure adhesion.
Battery fixation.
Flat surface sealing.
PCB assembly and protection.
After production, it is essential to thoroughly clean the adhesive rollers to prevent residual glue from curing and affecting subsequent production or product quality.
EUBO PUR Hot Melt Adhesive:
EUBO’s PUR hot melt adhesive is a general-purpose, single-component, moisture-curing hot melt with good initial tack at room temperature. From a performance perspective, we focus on enhancing PUR hot melt properties—such as viscosity, melting temperature, melt viscosity, and initial tack. Choosing the right adhesive is therefore a solid first step toward optimal results.
